CMP, Generally known as thermal oxidation polishing, utilizes MP in conjunction with chemicals to enhance the MRR and improve area top quality [20]. Figure two illustrates the schematic of a standard CMP process [21]. The SiC wafer, that is set about the carrier, plus the polishing pad move relative to https://www.quora.com/profile/Trevor-Flatcher-2/Advantages-of-Silicon-Carbide-Materials-in-High-Temperature-Electronic-Devices-Silicon-carbide-SiC-has-emerged-as-a-c